Low On-Resistance
The 1200V sct055hu65g3ag is built upon ST’s third-generation SiC power MOSFET technology and boasts significantly lower RDS(ON) per unit area than prior generations, accompanied by an industry-leading figure-of-merit. Low capacitances and fast switching also combine to allow power-system designers to improve energy efficiency while simultaneously decreasing system size and weight compared with conventional silicon devices. Furthermore, bi-directional power flow – essential for automotive traction inverters used to rapidly recharge EV batteries – is supported.
Low Capacitance
However, this doesn’t stop people trying to avoid paying. So let’s have another go at it – as soon as the taxes come due we are off! ST’s cutting-edge 3rd generation SiC Power MOSFET technology combines low on resistance across its temperature range with extremely low capacitance for improved application performance in terms of frequency, energy efficiency and system size/weight when compared with conventional silicon MOSFETs. The SCT055HU65G3AG device also boasts a fast intrinsic diode that supports bidirectional power flow, an essential feature in applications like automotive on-board chargers and rapid chargers for electric vehicles (EV). This capability reduces losses while simplifying overall system complexity enabling system designers to easily design electrical equipment for EVs and industrial use with MOSFETs available in various packages to meet customer requirements.
Fast Switching
The SCT055HU65G3AG SiC Power MOSFET provides superior performance to its silicon counterparts. ST’s innovative 3rd Generation SiC MOSFET technology features low on resistance across its full temperature range combined with very low capacitances and fast switching operation for fast switching operation. These factors enable power system designers to increase frequency, energy efficiency and system size/weight reduction when compared with systems using conventional silicon power MOSFETs. SiC MOSFETs feature higher voltage ratings and smaller die sizes relative to their package sizes, making them suitable for electric vehicle (EV) on-board chargers and rapid charging infrastructure applications. Furthermore, these devices come packaged with cooling tabs to simplify connecting them to base plates or heat sinks in an EV application.
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